(SAN JOSE, Calif.)Winbond Electronics Corporation America (WECA), a leading supplier of semiconductor solutions, today announced that it has earned the prestigious QS-9000 certification, a key requirement to becoming a supplier to top U.S. automotive companies and an upcoming requirement of the European automotive industry.
In order to achieve QS-9000 status, WECA has adapted its existing quality, development, and business systems to the stringent requirements of QS-9000. The certification enables companies to satisfy the exacting standards of the automotive industry where zero-defect dependability, on-time delivery, superior quality and product innovation are essential to success.
"Winbond, our parent company, has been QS-9000 certified for some time now. However, it was essential that WECA also become certified in order to increase regional participation in the automotive industry where significant growth has been projected worldwide in automotive multimedia, communications, and auto PC electronics markets."said Tom Sullivan, executive vice president, WECA."With this certification, WECA joins an elite group of manufacturers allowed to address this key market, and signifies the next crucial step in our quality roadmap."
About QS-9000
The goal for Quality System Requirements QS-9000 is the development of fundamental quality systems that provide for continuous improvement, emphasizing defect prevention and the reduction of variation and waste in the supply chain. QS-9000 defines the fundamental quality system expectations of Chrysler, Ford, General Motors, truck manufacturers and other subscribing companies for internal and external suppliers of production and service parts and materials. These companies are committed to working with suppliers to ensure customer satisfaction beginning with conformance to quality requirements, and continuing with reduction of variation and waste to benefit the final customer, the supply base, and themselves.
About Winbond
Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan.It has since become the largest branded IC Company in Taiwan, offering a broad range of PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, and memory ICs.Winbond is a market leader in the telephone dialer, PC I/O controller, memory, speech synthesizer and MPEG decoder markets. With four wafer fabs currently in operation, the Company utilizes process technologies ranging from 1.0 micron down to 0.175 micron. Winbond has more than 4,300 employees worldwide with design centers located in Hsinchu, Taiwan; Shanghai, China; San Jose, California; and Austin,Texas.
Spokesperson
Wilson Wen
Vice President of Administrative Center
Tel：03-5792755
News Liaison
Mike Liu
Deputy Director
Tel：03-5792516
Email：ckliu@winbond.com