Authentication Flash

Density 256Mb Industrial Status Not Recommend for New Design
Vcc 1.7V - 1.95V Frequency 104MHz
Package WSON 8x6, SOP16 300 mil, TFBGA24 6X8mm (5x5 Matrix) Temperature Range -40 ℃ ~ 125℃
Feature List Unique ID and Manufacture ID for Root keys, CID, and GID Generation
OTP and Unreadable Secure Storage for Root Keys
Flash Based Monotonic Counter for Timestemp
HMAC SHA-2 Hardware Engine for One-Time-Password Mutual Authentication
Winbond SPI Flash Command and Specification Compatible
Datasheet Buy Online

Technical Documentation


Contact us

Copyright © Winbond All Rights Reserved.

This website uses cookies to ensure you get the best experience on our website. Learn more