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Authentication Flash

Density 256Mb Industrial Status Not Recommend for New Design
Vcc 1.7V - 1.95V Frequency 104MHz
Package WSON 8x6, SOP16 300 mil, TFBGA24 6X8mm (5x5 Matrix) Temperature Range -40 ℃ ~ 125℃
Feature List Unique ID and Manufacture ID for Root keys, CID, and GID Generation
OTP and Unreadable Secure Storage for Root Keys
Flash Based Monotonic Counter for Timestemp
HMAC SHA-2 Hardware Engine for One-Time-Password Mutual Authentication
Winbond SPI Flash Command and Specification Compatible
Datasheet Buy Online

Technical Documentation

Resources

Winbond introduces the next generation 8Mb Serial Flash – W25Q80RV for low power and small form factor IoT devices

Product Press
As IoT devices become widely deployed in industrial factory automation and smart home control applications combining processing, connectivity, and sensor technologies in a system that is small and upgradeable, the demand grows for flash memories that come in small-form-factor packaging, consume a negligible amount of energy, and support fast software updates. The W25Q80RV is manufactured in Winbond’s own 12-inch wafer foundry utilizing the latest generation of Winbond’s 58nm technology. The die area is reduced by 40% compared to its predecessor which was built with 90nm technology.
W25Q80RV, 8Mb_Serial_Flash, low_power, IoT, KGD

Winbond Authentication Flash Product Brief

Product Brief
Authentication, W74M, security, multilayer, anticloning, automotive, rootkey, IoT
  • File Type：PDF
  • Updated：05/03/2023
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New Memory and Security Technologies for Designers of IoT Devices

Video

Winbond embedded world 2018_Authentication and SpiStack Flash Memory

Video
AspenCore, Winbond, Authentication
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