Density | 256Mb | Industrial Status | Not Recommend for New Design |
---|---|---|---|
Vcc | 1.7V - 1.95V | Frequency | 104MHz |
Package | WSON 8x6, SOP16 300 mil, TFBGA24 6X8mm (5x5 Matrix) | Temperature Range | -40 ℃ ~ 125℃ |
Feature List | Unique ID and Manufacture ID for Root keys, CID, and GID Generation OTP and Unreadable Secure Storage for Root Keys Flash Based Monotonic Counter for Timestemp HMAC SHA-2 Hardware Engine for One-Time-Password Mutual Authentication Winbond SPI Flash Command and Specification Compatible |
Technical Documentation
Resources

ウィンボンド、低消費電力で小型のIoT機器向けに 次世代8MビットシリアルNORフラッシュを発表
Product Press
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- Updated:15/06/2023
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Winbond Authentication Flash Product Brief
Product Brief
- File Type:PDF
- Updated:05/03/2023
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New Memory and Security Technologies for Designers of IoT Devices
Video
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- Updated:06/12/2018
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Winbond embedded world 2018_Authentication and SpiStack Flash Memory
Video
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- Updated:14/06/2018
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