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(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA <span class="match">Certified</span>™ Level 2 Ready in the PSA <span class="match">Certified</span> independent security assurance scheme. Now...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...

https://www.winbond.com/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en

CC EAL5+ certified W75F memory provides comprehensive protection for code and data New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global s...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/new-asil-d-boost-safety-and-security-credentials-on-w75f-secure-memory-element.html?__locale=en

(SAN JOSE, Calif.)Winbond Electronics Corporation America (WECA), a leading supplier of semiconductor solutions, today announced that it has earned the prestigious QS-9000 certification, a key requirement to becoming a supplier to top U.S. automotive companies and an upcoming requirement of the Euro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00022.html?__locale=en

Winbond Electronics Enters Automotive Flash Memory Market Serial Flash Memory Leader Applies its Design, Manufacturing Expertise to Provide TS16949-<span class="match">Certified</span>, AEC-Q100-Qualified Devices to Rapidly Expanding Market SAN JOSE, Calif., USA – Feb. 27, 2012 --Winbond Electronics Corp., a leading global su...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-enters-automotive-flash-memory-market.html?__locale=en

Munich, Germany – 13 November, 2018 -- Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authenti...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-tiempo-secure-offer-the-world-first-fully-cceal5-secure-element-ip-for-iot.html?__locale=en

Winbond TrustME® Secure Flash products strengthens the robustness by securing code and data storage for trusted boot and firmware updates using external secure flash. In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security...

https://www.winbond.com/hq/hq/product/trustme/index.html?__locale=en

The partnership will extend runtime integrity protection with secure NOR flash to improve cybersecurity for automotive, IoT, and other connected platforms PLANO, Texas – October 23, 2019 – Karamba Security, a world-leading provider of embedded cybersecurity for connected machines, today announced a ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-karamba-security-partner-for-embedded-cybersecurity.html?__locale=en

The partnership will be inclusive of major key provisioning, trusted storage of credentials and lifecycle management through Winbond TrustME® Secure Flash Memory combined with Secure-IC’s SecuryzrTM product for accelerated cybersecurity on connected platforms for secure boot, root of trust, executed...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-secure-ic-in-partnership-for-embedded-cybersecurity.html?__locale=en

Dates: September 22 to 24, 2015 Location: London, England Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s in...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-join-international-common-criteria-conference.html?__locale=en

Date: October 13, 2015 Location: Santa Clara, California, USA Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-joins-globalplatform-trusted-execution-environment-conference.html?__locale=en

In response to the coming of the digital family, Winbond is now targeting the specialty niche DRAM market. Among the specialty DRAM makers, we are one of the few IDM factories, which are capable of in-house research and development, manufacturing and marketing. Apart from providing you with high per...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-64mb-128mb-256mb-sdram.html?__locale=en

Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustMETM: the world’s f...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00015.html?__locale=en

Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s innovative secure memory solutions, TrustMETM: the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00016.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en