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Winbond Announces 512M bit <span class="match">mobile</span> LPDDR & LPSDRAM for <span class="match">mobile</span> display & <span class="match">mobile</span> data communication application Winbond Announces New 512Mbit <span class="match">mobile</span> LPSDRAM Mar/31/2011 512M <span class="match">mobile</span> LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-announces-512mb-mobile-lpddr-lpsdram-for-mobile-display-data-communication.html?__locale=en

Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the <span class="match">mobile</span> DRAM devices with a low IDD current value, which helps Winbond to extend <span class="match">mobile</span> DRAM memory applications beyond th...

https://www.winbond.com/hq/hq/product/mobile-dram/index.html?__locale=en

Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for <span class="match">mobile</span> applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-new-mobile-dram-psram.html?__locale=en

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for <span class="match">mobile</span> applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=en

Winbond Electronics Corporation, a leading supplier of semiconductor solutions, announced that during its annual product event, the Company will exhibit its suite of RAM IC solutions aimed at <span class="match">mobile</span> handheld devices. Addressing the needs of personal wireless communication products, such as cell phon...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-exhibits-mobile-ram-solution.html?__locale=en

(Hsin-Chu, Taiwan)Winbond Electronics Corporation today announced a ground breaking licensing agreement with Fujitsu Limited for developing Fast Cycle Random Access Memory (FCRAM)technology. The agreement involves Fujitsu licensing its proprietary 32M Mobile-FCRAM to Winbond. In return, Winbond, the...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00016.html?__locale=en

(TAICHUNG CITY, Taiwan –12 September, 2019)-With the driving force of new technologies such as artificial intelligence (AI), ultra-high-resolution display, 5G <span class="match">mobile</span> communication, and IoT, various kinds of new applications are emerging. Advanced Driver-Assistance Systems (ADAS), Smart Speakers, 8K ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-a-series-of-lpddr4x-at-niche-market.html?__locale=en

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of <span class="match">mobile</span> devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=en

Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. We are proud to introduce multiple Winbond IC designs as well as new products at the Shenzhen Convention and Exhibition Center (March 3th and 4th) and Shanghai Mart Expo (March 10th and 11th). Ou...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00008.html?__locale=en

Winbond Electronics Corp. will attend the upcoming Taitronics Bangkok 2007 Exhibition hosted by the Taipei World Trade Center (TWTC), Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), and Thai-Taiwan Business Association (TTBA). Multiple Winbond IC designs as well as new products ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00011.html?__locale=en

Winbond will attend the upcoming SemiTech Taipei (STT) Exhibition hosted by Taiwan Semiconductor Industry Association(TSIA) and Taipei Computer Association(TCA). Multiple Winbond IC designs as well as new products will be on display at theTaipei world Trade Center (May 10 th and 12 th). Our complete...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00012.html?__locale=en

Winbond Electronics Corp. is participating in 2008 Taipei Taitronics Autumn (Oct.7-11. ，Taipei World Trade Center Nangang Exhibition Hall, Booth No: 4F M102) Together with Nuvoton, Touch Micro-system Technology and HannStar Board corp. to demonstrate our complete range of products. Winbond’s product...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00007.html?__locale=en

Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-displays-multiple-key-chips-and-ic-design-technologies-at-2007-iic-china.html?__locale=en