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ISO21434 has been made mandatory by many car makers and their component suppliers, starting from mid-2022. As a result, the automotive industry is now required to significantly improve how cyber threats are managed. As this standard applies to both the modules and their components, it requires the automotive industry to adapt devices capable of meeting this standard and provide the required protection against cyber threats.

The past 18 months have seen unprecedented market change brought on by the global pandemic - which, like dropping a stone in a pond, will continue to create expanding ripples of change throughout the industry. One such ripple has been the global shortage of ICs, affecting the electronics industry and the worldwide economy.

Leveraging Octal interfaces for NAND flash memory will enable automotive, AI, consumer electronics, and industrial manufacturers to tap into this market growth opportunity by providing code storage in high density without having to pay a premium for NOR flash, a fast memory technology which scales poorly at densities above 512Mbits.

Automobile electronic systems are steadily becoming more intelligent. Advanced electronic functionality is being added throughout the vehicle such as ADAS, Gateway, Power Train, Infotainment, V2V, and V2X. These new capabilities are driving the need for increased security and safety.

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market.

The growth in the number of processor-based Electronic Control Units (ECUs) in cars is a familiar trend. Of equal significance to automotive system architects is the concurrent growth in the code footprint of new and developing applications in the car, a result in part of the increasing...

Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applications are still connected through 2G or 3G technology. In 2019, the estimated number of massive IoT applications have grown to triple and will reach approximately 100 million by the end of 2020.

A new generation of secure Flash memory products has come on to the market to provide a secure hardware foundation for embedded devices which do not require payment-grade protection. Often featuring a standard Flash memory package footprint and pin-out, and controlled via the standard SPI NOR Flash instruction set, these secure Flash memories are easy for general embedded device designers to implement a comprehensive set of security functions to protect connected devices from attack on a system’s integrity or data privacy.

New intelligent vision systems for the home, based on advanced image signal processors (ISPs), are in effect function-specific computers. The latest products in this category have adopted computer-like architectures which depend for low latency, highly responsive operation on fast DRAM system memory to store the application code running on the ISP...

As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly looking ahead to understand the broad trends in areas such as the medical equipment market...

In most systems in automobile, DRAM is responsible for storage of program codes and computing data, and it plays a more important role during the development of automobiles with more and more ICT functions, which include but are not limited to personal computers (PCs), servers, mobile devices and...

Around the world, the Covid-19 pandemic, and the strict lockdowns which governments have imposed to try to control the spread of infection, have brought short-term upheaval to every aspect of people’s lives. How does a memory IC manufacturer such as Winbond ensure that it is ready to meet the changed requirements of electronics device OEMs...