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On-demand Webinars
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Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America
Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash
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The requirement for secure storage has grown recently as more embedded systems have migrated to the IoT, opening previously closed systems to the threat of network-borne hacking attacks and malware. W77Q is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations like OTA updates and device authentication. Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Root of Trust and Remote Attestation - W77Q (part 3)
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In today's webinar, you will learn... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting Secure Firmware Update, Secure Firmware Storage, Secure Boot. Register now for the security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Platform Firmware Security - W77Q (Part 2)
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In today's webinar, we are going to talk about... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication. Register now for the 8 minute security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)
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Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director
New Generation of Advanced Flash for Connected Platforms
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In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices. The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive
How to add multi-layered authentication into your IoTs?
Technical Articles
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Memory technology, exemplified by Winbond's solutions, continues to provide crucial support for CMS. With its remarkable cost-efficiency, Winbond's memory products are poised to accelerate the adoption of electronic side and rear-view mirrors, making them more accessible to drivers sooner than later.
Enhancing the Future Driving Experience: The Power of Memory in Camera Monitor Systems
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The semiconductor industry, a crucial player in global decarbonization and electrification, recognises its role in environmental stewardship and has taken steps to align with global standards and initiatives aimed at improving industrial environmental performance. These include the environmental standard ISO 14001 and Reduction of Hazardous Substances.
Outlook 2024: An Ever Growing Imperative
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How these tiny sensors change the fairness and accuracy in football is directly attributed to the chips supporting the underlying Technology. The success of edge computing will increasingly rely on indispensable internal memory as the Internet of Things moves us towards a more closely connected world...
While VAR Impacts Soccer, the IoT Impacts the World
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With the evolution of automobiles to digitalization, the demand for data storage and the transmission of information is getting higher. All automotive applications require qualified storage products and devices that will endure in embedded environments exposed to extreme temperatures...
Flash Memory Market Ushered in Fierce Competition with the Digitalization of Electric Vehicles
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According to PwC's estimate, the metaverse market will exceed $1.5 trillion by 2030, with semiconductors being one of the key driving factors in its development. The semiconductor industry will likely usher in new growth with the progress of the metaverse market, with the strongest push coming from semiconductor products related to computing.
The New Role of Storage Manufacturers in the Metaverse
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AI technology is divided into two categories; Training and Inference. AI-related chips include CPU, GPU, FPGA, TPU and, ASIC. To get an idea of how these chips compare to one another, here is a comparison focusing of 5 key factors...
Choosing the Right Flash Memory for AI Endpoint Applications
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ISO21434 has been made mandatory by many car makers and their component suppliers, starting from mid-2022. As a result, the automotive industry is now required to significantly improve how cyber threats are managed. As this standard applies to both the modules and their components, it requires the automotive industry to adapt devices capable of meeting this standard and provide the required protection against cyber threats.
Achieving ISO/SAE21434 Cyber Security Using Secure Flash
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Leveraging Octal interfaces for NAND flash memory will enable automotive, AI, consumer electronics, and industrial manufacturers to tap into this market growth opportunity by providing code storage in high density without having to pay a premium for NOR flash, a fast memory technology which scales poorly at densities above 512Mbits.
The Rise of OctalNAND for Automotive, OTA, AI and More!
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Automobile electronic systems are steadily becoming more intelligent. Advanced electronic functionality is being added throughout the vehicle such as ADAS, Gateway, Power Train, Infotainment, V2V, and V2X. These new capabilities are driving the need for increased security and safety.
The Hidden Security Risks of Automotive Electronic Systems
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The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market.
Low Density of LPDDR4x DRAM – the Best Choice for Edge AI
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The growth in the number of processor-based Electronic Control Units (ECUs) in cars is a familiar trend. Of equal significance to automotive system architects is the concurrent growth in the code footprint of new and developing applications in the car, a result in part of the increasing...
QspiNAND with ultra-fast write speed: A new option for over-the-air updating of automotive code
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Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applications are still connected through 2G or 3G technology. In 2019, the estimated number of massive IoT applications have grown to triple and will reach approximately 100 million by the end of 2020.
HyperRAM™- Best DRAM choice for IoT application