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On-demand Webinars
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Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America
Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash
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The requirement for secure storage has grown recently as more embedded systems have migrated to the IoT, opening previously closed systems to the threat of network-borne hacking attacks and malware. W77Q is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations like OTA updates and device authentication. Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Root of Trust and Remote Attestation - W77Q (part 3)
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In today's webinar, you will learn... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting Secure Firmware Update, Secure Firmware Storage, Secure Boot. Register now for the security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Platform Firmware Security - W77Q (Part 2)
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In today's webinar, we are going to talk about... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication. Register now for the 8 minute security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)
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Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director
New Generation of Advanced Flash for Connected Platforms
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In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices. The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive
How to add multi-layered authentication into your IoTs?
Technical Articles
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Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applications are still connected through 2G or 3G technology. In 2019, the estimated number of massive IoT applications have grown to triple and will reach approximately 100 million by the end of 2020.
HyperRAM™- Best DRAM choice for IoT application
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A new generation of secure Flash memory products has come on to the market to provide a secure hardware foundation for embedded devices which do not require payment-grade protection. Often featuring a standard Flash memory package footprint and pin-out, and controlled via the standard SPI NOR Flash instruction set, these secure Flash memories are easy for general embedded device designers to implement a comprehensive set of security functions to protect connected devices from attack on a system’s integrity or data privacy.
How new secure Flash devices promise comprehensive security for IoT devices’ code and data
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New intelligent vision systems for the home, based on advanced image signal processors (ISPs), are in effect function-specific computers. The latest products in this category have adopted computer-like architectures which depend for low latency, highly responsive operation on fast DRAM system memory to store the application code running on the ISP...
A camera or a computer? How the architecture of new home security vision systems affects their choice of system memory technology
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As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly looking ahead to understand the broad trends in areas such as the medical equipment market...
New generation of wearable medical devices calls for secure, high-density non-volatile memory
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In most systems in automobile, DRAM is responsible for storage of program codes and computing data, and it plays a more important role during the development of automobiles with more and more ICT functions, which include but are not limited to personal computers (PCs), servers, mobile devices and...
Solution for Automotive application based on the Fourth Generation and its extension version of Low Power DRAM (LPDDR4/4x)
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Around the world, the Covid-19 pandemic, and the strict lockdowns which governments have imposed to try to control the spread of infection, have brought short-term upheaval to every aspect of people’s lives. How does a memory IC manufacturer such as Winbond ensure that it is ready to meet the changed requirements of electronics device OEMs...
Three mega-trends for a post-Covid world, and how they affect users of memory technology
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The use of semiconductor memory has grown and the size of these memory cards has also increased to accommodate large amounts of storage. To meet the growing demand, new memory technologies are introduced by expert memory technology companies like Winbond Electronics Corporation...
A prominent leader in the semiconductor memory technology segment: Winbond
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Embedded developers should open their minds to the potential benefits of replacing SPI NOR Flash with serial NAND Flash for storing mission-critical boot and application code, and to reconsider their assumptions about the reliability, longevity and performance of NAND.
Why embedded developers are considering serial NAND Flash for code storage in systems that implement artificial intelligence
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HyperRAM™ is a new technical solution which supports the HyperBus™ interface. The first generation of it offers a throughput up to 333 MB/s, and HyperRAM™ 2.0 made it possible to boost up to 400 MB/s.
What You Need to Know about HyperRAM™ – An Alternative Memory Option
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Developers of security-conscious applications now have a new way to implement encryption and other essential functions while benefiting from memory provision sufficient for today’s systems and for future application developments.
A new architecture for the provision of secure storage offers higher capacity at lower cost
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5G is a technology platform which supports many potential use cases and end product types. This eliminates the need for a considerable portion of the 5G protocol software code base, and means that a smaller, and cheaper, NAND Flash device for code storage can be used.
New lower-cost memory solution for 5G cellular modems helps drive adoption of ultra-fast wireless broadband
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Automotive displays, both in the instrument cluster and in the Centre Information Display (CID), or head unit, are becoming larger, more sophisticated and more numerous. Car users have grown accustomed to interacting with technology via colourful graphics rendered on large, high-resolution displays.
A better high-density storage option for sophisticated automotive display applications