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Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

Date : Sep/5/2007-Sep/8/2007
Location : Hangzhou Peace International Exhibition & Conference Center
Booth : H13-23, G14-24 

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce. Multiple Winbond IC designs as well as new products will be on display at the Hangzhou Peace International Exhibition & Conference Center from Sep 5th to 8th. Winbond’s complete product lines include Mobile RAM, Computer Logic IC, Flash Memory, and μC and μC-Based Consumer IC. Details of the products on display are as follows:

Mobile RAM for Mobile Phones 
• SDRAM: 64Mb (W9864 Series), 128Mb (W9812 Series) and 256M (W9825 Series)  
• Largest Capacity Pseudo SRAM on the Market

Computer Logic IC & Flash Memory for Information Electronics 
• New ICs and Solutions for New Generation PC Platforms
• New Flash Memory Products: 32Mb/64Mb SPI & 4Mb/16Mb/32Mb Parallel

μC and μC-Based Consumer IC for Consumer and Automobile Electronics 
• 8-bit (8051 Core) LPC Series with Reference Applications 
• 32-bit Digital Frames Development Systems
• New USB Audio Controller IC Series 
• ISD1700 Voice & Speech ICs (ChipCorder®) 
• Single Programmable Extended CODEC/SLIC IC for the VoIP Market

For more information about eif exhibition 2007, please visit: http://www.eifhz.com/

 



News Contact:
Erin Chou
Sales Promotion
TEL :886-3-5678168 ext. 8686 
Email:chchou7@winbond.com

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