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Mobile phones have become an integral part of our daily lives providing a compact platform for work and play. With newer software requiring faster computing, optimized RAM makes all the difference. Low power DDR SDRAM is a synchronous DRAM optimized for numerous IoT applications. What Is a Low-Power...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr-sdram/index.html?__locale=en

In addition to ultra-high-speed data processing, modern IoT devices require long-lasting batteries. To achieve this, onboard RAM needs to operate efficiently by using the <span class="match">low</span>est possible power settings. Low power synchronous dynamic RAM (Low power SDRAM) integrates energy-saving technology that allo...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-sdr-sdram/index.html?__locale=en

The use of double data rate synchronous dynamic random-access memory (DDR SDRAM) in modern IoT devices has significantly improved computer data processing. While DDRs al<span class="match">low</span> faster data transmission than single rate memories, the improved performance often translates to greater power consumption. Low...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr2-sdram/index.html?__locale=en

Low-Density Memory for AI-Enabled Devices Many smartphones, smart vehicles, wearables, and several other IoT devices now integrate edge AI to optimize their processes. These devices require ultra-fast data processing memories to perform optimally. Low power DDR4 SDRAM especially the LPDDR4X variants...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr4-ddr4x-sdram/index.html?__locale=en

With the increasing functionality of IoT processes, mobile device developers are constantly searching for smaller, faster memory chips to integrate into their products. While standard DDR RAM chips are optimized for ultra-fast data processing, <span class="match">low</span> power variants like the LPDDR3 are an excellent choi...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr3-sdram/index.html?__locale=en

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en

Winbond HYPERRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en

Winbond is offering a new way to extend the power savings available from Partial Array Self-Refresh (PASR), which was already specified in the JEDEC standard by implementing a new Deep Self-Refresh (DSR) mode. DSR operates in a similar way to PASR at <span class="match">low</span> data rates, allocating used data to one or mo...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00010.html?__locale=en

New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en

Winbond HyperRAM™ delivers <span class="match">low</span> power and <span class="match">low</span> pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-<span class="match">low</span> power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

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https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

Highlights Winbond’s corporate commitment to address environmental and sustainability issues on a global scale Company’s Flash Memory products in SON and BGA packages will support LTS this month Moving to LTS also helps simplify and shorten the SMT Process, and reduce production costs TAICHUNG, Taiw...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_adopts_low_temperature_soldering_lts_slow_global_warming.html?__locale=en

Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, <span class="match">low</span>-power consumption and down-sizing. Fully understanding market...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-has-come-up-with-a-new-low-density-ddr3-sdram.html?__locale=en

Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, <span class="match">low</span> power, and available in small-form-factor for addressing the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=en