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Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile  DRAM and PSRAM that meet the increasing need of low power consumption.

Mobile DRAM 
512Mb W949D6BZX/ W949D2BZX/ W989D2BZX, 1Gb W94AD2BZX

Mobile devices specification and requirements for EuP (Energy Using Products) on consumer devices have stimulated demand for low power memory.  Winbond’s Mobile DRAM family provides both SDR and DDR, with high density – 512Mb to 1Gb. The entire family complies to JEDEC specifications for both functionality and pin definitions.

The W949D2B and W949D6B are 512Mb devices, supporting DDRx32/x16 data widths at operating voltages of 1.8V; W94AD2B is 1Gb device, supporting DDRx32 data widths at operating voltages of 1.8V.  All products provide advanced power-saving features including Partial Array Self Refresh (PASR), Auto Temperature Compensated Refresh (ATCSR), Deep Power Down Mode.

They are ideal for handheld DTV, PND/GPS, PDA phone, Wireless IP Cam, MP3/MP4 player, E-book, Mobile gaming, Wimax devices. 

Pseudo SRAM (PSRAM)
32Mb W965A6F, 64Mb W966A6C, 128Mb W967D6D/W957D6D, 256Mb W968D6B

Pseudo SRAM (PSRAM) enables faster memory access for mobile applications. PSRAM features a standard SRAM interface, 1-transistor DRAM-like memory cells and an on-chip refresh circuit, which make it an easy design-in. For added flexibility, Winbond’s PSRAM family provides data densities from 16 Mb to 256 Mb. The 256 Mb PSRAM, which complies with Cellular RAM 2.0G Standard, has one of the highest densities available in the market.

About Winbond

Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan and has been publicly traded on the Taiwan Stock Exchange since 1995. In October 2008, the headquarters is relocated to Central Taiwan Science Park where newly built the 300mm wafer fab. The site is mainly focusing on research & development and production, of which the process technology covers from 90nm~65nm.

Winbond focuses on the Memory Products design and manufacturing with three main business groups—DRAM Product Business Group, Memory IC Manufacturing Business Group, and Flash Memory IC Business Group. To maintain its long-term relationships with its customers and strengthen regional supports, Winbond has set up subsidiaries in the USA, Japan, and Hong Kong.

For more information, please visit:http://www.winbond.com

Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Product Contact:

Rex Liu
Mobile RAM Marketing Division
TEL: +886-3-5678168 # 6091
E-Mail: HHLiu2@winbond.com

News Contacts:

Lily Chien
Sales Coordination Dept.
TEL: +886-2-81777168 # 1338
Email: KLChien@winbond.com

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