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Mobile DRAM - HYPERRAM
HYPERRAM™
Winbond <span class="match">HYPERRAM</span>™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of <span class="match">HYPERRAM</span>™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb. For package type, <span class="match">HYPERRAM</span> s...
https://www.winbond.com/hq/hq/product/mobile-dram/hyperram/index.html?__locale=en
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Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0
News
3rd Generation <span class="match">HYPERRAM</span> offers simplified design and double data-transfer rate for better performance in IoT devices TAICHUNG, Taiwan– 2022-04-14 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in sem...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-infineon-double-bandwidth-for-iot-applications-with-hyperram3.0.html?__locale=en
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What You Need to Know about HyperRAM™ – An Alternative Memory Option
Technical Article
What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-you-need-to-know-about-hyperram.html?__locale=en
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Winbond HYPERRAM™ - Best DRAM Choice for AIoT Application
https://www.winbond.com/hq/support/online-learning/video-item/Winbond-HYPERRAM-Best-DRAM-Choice-for-AIoT-Application
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Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
News
TAICHUNG, TAIWAN–2022-12-09—Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that it has been awarded the 7th China IoT Technology Innovation Award 2022 by Elecfans for its continuous pursuit of technological innovation and excellent produ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_hyperram_wins_china_iot_innovation_awards_2022.html?__locale=en
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HyperRAM won Memory IC Awards of 2021 EE Awards Asia
Other
https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en
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Winbond moves into HyperRAM™ market to address new AIoT application needs
News
(HSINCHU, Taiwan –30 October, 2019) With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU supp...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-can-address-new-aiot-application-needs.html?__locale=en
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W958D6NW 256Mb HyperRAM 3.0 x16 WLCSP30 Ball datasheet A01-007_20230314
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W958D6NW.html&level=1
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W958D8NW 256Mb HyperRAM x8 WLCSP30 Ball datasheet A01-006_20230314
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W958D8NW.html&level=1
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W957D6NBGX 128Mb HyperRAM 3.1 x16 WFBGA49 SDP datasheet A01-001_20231130
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W957D6NBGX.html&level=1
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Efinix Selects Winbond HyperRAM™ for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices
News
Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en
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Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
News
Winbond <span class="match">HYPERRAM</span>™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s <span class="match">HYPERRAM</span> Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based <span class="match">HYPERRAM</span> x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en
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W958D8NW 256Mb HyperRAM X8 WLCSP30 protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-GAA110_33.html&level=1
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W958D6NW 256Mb HyperRAM 3.0 x16 protected verilog model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA02-GAA110_32.html&level=1
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Gowin Semiconductor embeds 64Mb HyperRAM™ DRAM from Winbond to give space and power savings in its latest solution for AI edge computing
News
Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature KGD form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/gowin-embeds-winbond-64mb-hyperram-for-ai-edge-computing.html?__locale=en
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Keyword search results for “ HYPERRAM ”, 45 Matches