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HyperRAMTM devices with Wafer Level Chip Scale Package (<span class="match">WLCSP</span>) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W956D8MW.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-GAA110_21.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-GAA110_18.html&level=1

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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-GAA110_15.html&level=1

Winbond HYPERRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HYPERRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb. For package type, HYPERRAM s...

https://www.winbond.com/hq/hq/product/mobile-dram/hyperram/index.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=en

CC EAL5+ certified W75F memory provides comprehensive protection for code and data New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global s...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/new-asil-d-boost-safety-and-security-credentials-on-w75f-secure-memory-element.html?__locale=en

3rd Generation HYPERRAM offers simplified design and double data-transfer rate for better performance in IoT devices TAICHUNG, Taiwan– 2022-04-14 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in sem...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-infineon-double-bandwidth-for-iot-applications-with-hyperram3.0.html?__locale=en

Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-industrial-smallest-serial-flash-for-space-critical-applications.html?__locale=en

https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00001.html?__locale=en