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Winbond 1.2V Serial NOR Flash Product Brief
Code Storage Flash Memory1.2V Serial NOR FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf
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How improved die-stacking technology reduces pin count, board footprint and system complexity
Technical Article
The direction and force of consumer demand is relentless: buyers of mobile and computing devices are constantly looking for products that offer more features and better performance in a smaller, lighter, sleeker form factor. Applications that once would have required a laptop have migrated to the sm...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-improved-die-stacking-technology-reduces-pin-count-board-footprint-system-complexity.html?__locale=en
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The keys to successful adoption of new low-voltage memory ICs
Technical Article
Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=en
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