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As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly look...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/new-wearable-medical-devices-calls-for-secure-high-density-memory.html?__locale=en

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

Modern IoT devices rely on dedicated computer memory units to function. Random-access memory (RAM) units enable critical functions in these IoT devices and have evolved with an increasing need for compactness and functionality. What Constitutes RAM? Computer RAM can either be static random-access me...

https://www.winbond.com/hq/hq/product/mobile-dram/pseudo-sram/index.html?__locale=en

The world is witnessing incredible growth in IoT, adding sensors and connectivity to all kinds of devices, including transportation, factories, wearable devices, and smart home applications. The data generated by these devices is also driving the need for increased processing to bring AI to the edge...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00026.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond th...

https://www.winbond.com/hq/hq/product/mobile-dram/index.html?__locale=en

The W25QxxND 1.2V series of Serial NOR Flash has performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. Packages offered: 2mm x 3mm USON8 narrow 150mil SOP8 6x5mm WSON 8-pin KGD (Known Good Die) The packages offered provide designers with th...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/index.html?__locale=en

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en

Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=en

New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf

HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en

Low-Density Memory for AI-Enabled Devices Many smartphones, smart vehicles, wearables, and several other IoT devices now integrate edge AI to optimize their processes. These devices require ultra-fast data processing memories to perform optimally. Low power DDR4 SDRAM especially the LPDDR4X variants...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr4-ddr4x-sdram/index.html?__locale=en

Winbond TrustME® Secure Flash products strengthens the robustness by securing code and data storage for trusted boot and firmware updates using external secure flash. In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security...

https://www.winbond.com/hq/hq/product/trustme/index.html?__locale=en