-
Winbond has unveiled its latest 1Gb QspiNAND Flash for wearable and low-power IoT devices
News
Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=en
-
New generation of wearable medical devices calls for secure, high-density non-volatile memory
Technical Article
As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly look...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/new-wearable-medical-devices-calls-for-secure-high-density-memory.html?__locale=en
-
Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference
News
MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en
-
Mobile DRAM - Pseudo SRAM
Pseudo SRAM
Modern IoT devices rely on dedicated computer memory units to function. Random-access memory (RAM) units enable critical functions in these IoT devices and have evolved with an increasing need for compactness and functionality. SEARCH FOR THE PRODUCT SPEC What Constitutes RAM? Computer RAM can eithe...
https://www.winbond.com/hq/hq/product/mobile-dram/pseudo-sram/index.html?__locale=en
-
Winbond HYPERRAM™ - Best DRAM Choice for AIoT Application
https://www.winbond.com/hq/support/online-learning/video-item/Winbond-HYPERRAM-Best-DRAM-Choice-for-AIoT-Application
-
Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables
News
Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en
-
Mobile DRAM
Mobile DRAM
Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond th...
https://www.winbond.com/hq/hq/product/mobile-dram/index.html?__locale=en
-
Code Storage Flash Memory - 1.2V Serial NOR Flash
1.2V Serial NOR Flash
The W25QxxND 1.2V series of Serial NOR Flash has performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. Packages offered: 2mm x 3mm USON8 narrow 150mil SOP8 6x5mm WSON 8-pin KGD (Known Good Die) The packages offered provide designers with th...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/index.html?__locale=en
-
Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part
News
New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en
-
The keys to successful adoption of new low-voltage memory ICs
Technical Article
Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=en
-
Winbond Introduces First Very-Low-Voltage Flash Memories
News
New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en
-
Low Density of LPDDR4x DRAM – the Best Choice for Edge AI
Technical Article
The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en
-
Winbond 1.2V Serial NOR Flash Product Brief
Code Storage Flash Memory1.2V Serial NOR FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf
-
Winbond leads the era of wearable devices with the launch of HyperRAM™ WLCSP package
News
HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en
-
Winbond Will Join FMS on Santa Clara Convention Center
https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Will-Join-FMS-on-Santa-Clara-Convention-Center
HOME>
Search
Search
Keyword search results for “ Wearable ”, 28 Matches