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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000018.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA00-W25M121AV.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA00-W25M321AV.html&level=1

概述 華邦SpiFlash/<span class="match">SpiStack</span>測試開發套件是一個基於 Mbed OS 啟動之MCU主控板，用以搭配Arduino UNO R35終端及其衍生擴充板或子板。您可透過此套件輕鬆嘗試Quad SPI快閃記憶體之操作。 a)Mbed OS 啟動之MCU主控板 Part Number MCU Supplier M487JIDAE Nuvoton Technology b)擴充板 c)子板 Part Number Density Product Type Operation Temperature W25Q128JVEIQ 128Mb 3.3V Serial NOR Flash Memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00020.html?__locale=zh_TW

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA00-W25M161AV.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000014.html&level=4

針對不同應用領域可靈活組合成不同容量的全新系列產品 (2016年4月12日加州聖荷西/台灣台中訊) 全球記憶體領導供應商之一的華邦電子，今日宣布推出具創新性的快閃記憶體產品系列─可堆疊式<span class="match">SpiStack</span>®串列式快閃記憶體。該新產品 ─ <span class="match">SpiStack</span>® W25M系列是全球第一種可堆疊同性質或不同性質的串列式快閃記憶體 (SpiFlash) 於標準8引腳的封裝內的產品，其可為各類應用領域之研發人員對於儲存程式碼或資料等不同之需求提供合適的容量組合方案。 W25M系列將繼續採用研發人員熟悉的8引腳封裝，並擴展串列式快閃記憶體不同的容量範圍。除此之外，W25M的產品特性是支持標準多通道I/O、SP...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-spistack-in-8-Pin-packages.html?__locale=zh_TW

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000011.html&level=1

(2021-07-07臺灣台中訊)—全球半導體記憶體解決方案領導廠商華邦電子於今日宣布，正式確認華邦HyperRAM™ 和<span class="match">SpiStack</span>® (NOR+NAND) 產品能夠與瑞薩基於Arm® 基準的 RZ/A2M微處理器 (MPU) 搭配使用。 華邦長期向瑞薩供應各類外部記憶體，其中包括DRAM、NOR Flash和NAND Flash等嵌入式系統的主流記憶體產品， RZ/A2M的客戶也因此受益。 瑞薩RZ/A2M微處理器適用於人機界面 (HMI)，尤其是帶有鏡頭的HMI應用。 RZ/A2M還支援廣泛應用於移動設備的移動產業處理器介面 (MIPI)，並配備了用於高速影像處理的動態可配置處理器 ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-and-spistack-and-renesas-rza2m-accelerate-embedded-ai-system.html?__locale=zh_TW

華邦堆疊兩個記憶體晶片在單一個封裝中，其中一個晶片用於執行寫入/擦除操作，另一個晶片則可同時執行讀取操作，進而實現更好的OTA更新流程。 華邦<span class="match">SpiStack</span> 提供高容量且快速寫入的NAND記憶體，可為多個ECU的OTA管理應用提供合適的解決方案。 (2021-12-23臺灣台中訊) —全球半導體記憶體解決方案領導廠商華邦電子今日發表旗下<span class="match">SpiStack</span>®產品用於汽車和物聯網設備的OTA韌體更新的獨特優勢。OTA更新目前已成為汽車、物聯網和工業應用的關鍵功能，而華邦提供的創新<span class="match">SpiStack</span>解決方案是在單一個封裝中堆疊兩個記憶體晶片，可使兩個記憶體同時讀寫，此操作方式可協助客戶實現快速、可靠、...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_spistack_ota_automobile_iot_two_stacked_dies_faster_more_accurate.html?__locale=zh_TW

Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering <span class="match">SpiStack</span>, 1.2V flash, and Authentication memories....

https://www.winbond.com/hq/hq/support/online-learning/webinars-item/webinars00002.html?__locale=zh_TW

華邦電子W25M161AW <span class="match">SpiStack</span>產品（8 mm×6 mm）提供可儲存開機代碼16Mb NOR Flash及1Gb NAND Flash給Linux®或其他作業系統使用。 （2019年8月6日加州聖克拉拉訊）- 全球半導體儲存解決方案領導廠商華邦電子今日宣布其首創之<span class="match">SpiStack</span>® NOR+NAND 可堆疊式記憶體甫獲恩智浦半導體FRWY-LS1012A開發板採用，以搭配該公司Layerscape® LS1012A 系列之通信處理器。 恩智浦半導體已將華邦電子之W25M161AW <span class="match">SpiStack</span> 產品納入其新推出的FRWY-LS1012A 開發板設計中，其主要用以開發LS1012...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/space_saving_winbond_nor_nand_dual_die_memory_supports_nxp_layerscape_ls1012a_.html?__locale=zh_TW

https://www.winbond.com/productResource-files/Winbond%20SpiStack%20Flash%20Product%20Brief.pdf

Winbond is the first company to offer the new spistack W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements.

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00012.html?__locale=zh_TW

What is the simplest and quickest way to add "multi-layer authentication" into your existing designs? And what is <span class="match">SpiStack</span> Flash Memory? Why stacked die?

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00003.html?__locale=zh_TW