Technical Articles

Winbond we provide you a wide range of online technical articles for your further exploration. In the meantime, you can also contact us for any further discussion with our Winbond experts.

Enhancing the Future Driving Experience: The Power of Memory in Camera Monitor Systems

Memory technology, exemplified by Winbond's solutions, continues to provide crucial support for CMS. With its remarkable cost-efficiency, Winbond's memory products are poised to accelerate the adoption of electronic side and rear-view mirrors, making them more accessible to drivers sooner than later... Read more

Outlook 2024: An Ever Growing Imperative

The semiconductor industry, a crucial player in global decarbonization and electrification, recognises its role in environmental stewardship and has taken steps to align with global standards and initiatives aimed at improving industrial environmental performance. These include the environmental sta... Read more

Low Density of LPDDR4x DRAM – the Best Choice for Edge AI

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market. Read more

HyperRAM™- Best DRAM choice for IoT application

Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applications are still connected through 2G or 3G technology. In 2019, the estimated number of massive IoT applications have grown to triple and will reach approximately 100 million by... Read more

What You Need to Know about HyperRAM™ – An Alternative Memory Option

HyperRAM™ is a new technical solution which supports the HyperBus™ interface. The first generation of it offers a throughput up to 333 MB/s, and HyperRAM™ 2.0 made it possible to boost up to 400 MB/s. Read more

Live over-the-air system firmware updates to Flash

Which memory architecture gives the best combination of cost, reliability and performance? This article explores several such design techniques, and explains how the use of Winbond’s SpiStack® memory provides unique benefits when implementing the OTA function in existing hardware designs. Read more

Check connection between SOC and DRAM with IC Boundary Scan Technology

Winbond's new parts offering the Boundary Scan option will give manufacturers of mobile phones and other devices a new means to reduce total cost attributable to the DRAM and to take advantage of additional time savings with an easy way in being operated in Boundary Scan mode. Read more

Combining deep power-down with self-refresh mode

Winbond introduces the new parts offering the DSR option will give manufacturers of mobile phones and other battery-powered devices a new means to reduce total energy use attributable to the DRAM and take advantage of additional power savings when the device is operating at a low data-transfer rate. Read more

You May Also Be Interested In

Next Webinars

  • Date
    Webinar Topic
  • Coming Soon

On-demand Webinars

Contact us

Copyright © Winbond All Rights Reserved.

This website uses cookies to ensure you get the best experience on our website. Learn more