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White Paper: Revolutionizing Edge AI Computing with CUBE
This whitepaper explores the innovative CUBE (Customized Ultra-Bandwidth Elements) technology developed by Winbond Electronics Corporation, designed to revolutionize AI computing on edge platforms. CUBE addresses the increasing demand for AI applications by providing a highbandwidth, power-efficient...
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Enhancing the Future Driving Experience: The Power of Memory in Camera Monitor Systems
Memory technology, exemplified by Winbond's solutions, continues to provide crucial support for CMS. With its remarkable cost-efficiency, Winbond's memory products are poised to accelerate the adoption of electronic side and rear-view mirrors, making them more accessible to drivers sooner than later...
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Outlook 2024: An Ever Growing Imperative
The semiconductor industry, a crucial player in global decarbonization and electrification, recognises its role in environmental stewardship and has taken steps to align with global standards and initiatives aimed at improving industrial environmental performance. These include the environmental sta...
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Low Density of LPDDR4x DRAM – the Best Choice for Edge AI
The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market.
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HyperRAM™- Best DRAM choice for IoT application
Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applications are still connected through 2G or 3G technology. In 2019, the estimated number of massive IoT applications have grown to triple and will reach approximately 100 million by...
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What You Need to Know about HyperRAM™ – An Alternative Memory Option
HyperRAM™ is a new technical solution which supports the HyperBus™ interface. The first generation of it offers a throughput up to 333 MB/s, and HyperRAM™ 2.0 made it possible to boost up to 400 MB/s.
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Live over-the-air system firmware updates to Flash
Which memory architecture gives the best combination of cost, reliability and performance? This article explores several such design techniques, and explains how the use of Winbond’s SpiStack® memory provides unique benefits when implementing the OTA function in existing hardware designs.
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Check connection between SOC and DRAM with IC Boundary Scan Technology
Winbond's new parts offering the Boundary Scan option will give manufacturers of mobile phones and other devices a new means to reduce total cost attributable to the DRAM and to take advantage of additional time savings with an easy way in being operated in Boundary Scan mode.
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Combining deep power-down with self-refresh mode
Winbond introduces the new parts offering the DSR option will give manufacturers of mobile phones and other battery-powered devices a new means to reduce total energy use attributable to the DRAM and take advantage of additional power savings when the device is operating at a low data-transfer rate.
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