Winbond HYPERRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HYPERRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb. For package type, HYPERRAM supports 24BGA, WLCSP and KGD.
Ultra-low Power Consumption:
Winbond’s Hybrid Sleep Mode (HSM) gives standby power consumption as low as 35μW, and operating power less than half that of equivalent pSRAM products.
Design Simplicity:
HYPERRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture.
Space-saving:
Low pin-count packages and a lower number of connections to the host controller reduce the memory system’s board footprint and save space in consumer devices such as smart watches.
