Winbond HYPERRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HYPERRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb. For package type, HYPERRAM supports 24BGA, WLCSP and KGD.

Ultra-low Power Consumption:
Winbond’s Hybrid Sleep Mode (HSM) gives standby power consumption as low as 35μW, and operating power less than half that of equivalent pSRAM products.
Design Simplicity:
HYPERRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture.
Low pin-count packages and a lower number of connections to the host controller reduce the memory system’s board footprint and save space in consumer devices such as smart watches.


Part No. Voltage Speed Temp. Organization Status Industrial & Commercial
Automotive Industrial & Commercial
W959D8NFY 1.8V 400Mbps / 500Mbps -40°C~85°C/ Automotive 64Mx8 P P contact us
W959D6NFK 1.8V 400Mbps / 500Mbps -40°C~85°C 32Mx16 - P pdf
Status1:P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
Status2:All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

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