2Gb NAND + 1Gb LPDDR2

• Features

  W29N02GZ NAND Flash Memory
  • Basic Features
  – Density : 2Gbit (Single chip solution)
  – Vcc : 1.7V to 1.95V
  – Bus width : x8
  – Operating temperature
     Industrial: -40°C to 85°C
  • Single-Level Cell (SLC) technology.
  • Organization
  – Density: 2G-bit/256M-byte
  – Page size
     2,112 bytes (2048 + 64 bytes)
  – Block size
     64 pages (128K + 4K bytes)
  • Highest Performance
  – Read performance (Max.)
     Random read: 25us
     Sequential read cycle: 25ns
  – Write Erase performance
     Page program time: 250us(typ.)
     Block erase time: 2ms(typ.)
  – Endurance 100,000 Erase/Program Cycles
  – 10-years data retention
  • Command set
  – Standard NAND command set
  – Additional command support
     Copy Back
     Two-plane operation
  – Contact Winbond for OTP feature
  – Contact Winbond for block Lock feature
  • Lowest power consumption
  – Read: 25mA(typ.3V),T.B.D(typ.1.8V)
  – Program/Erase: 10mA(typ.1.8V)
  – CMOS standby: 10uA(typ.)

  W97AH2KK Low Power DDR2 SDRAM
  • VDD1 = 1.7~1.95V
  • VDD2/VDDCA/VDDQ = 1.14V ~ 1.30V
  • Data width: x32
  • Clock rate: up to 533MHz
  • Four-bit prefetch DDR architecture
  • Eight internal banks for concurrent operation
  • Programmable READ and WRITE latencies (RL/WL)
  • Programmable burst lengths: 4, 8, or 16
  • Per Bank Refresh
  • Partial Array Self-Refresh(PASR)
  • Deep Power Down Mode (DPD Mode)
  • Programmable output buffer driver strength
  • Data mask (DM) for write data
  • Clock Stop capability during idle periods
  • Double data rate for data output
  • Differential clock inputs
  • Bidirectional differential data strobe
  • Interface: HSUL_12
  • JEDEC LPDDR2-S4B compliance
  • Operating Temperature Range
  -40 ~ 85 °C

Package

8x10.5x1.0