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キーワードの捜索結果“ automotive ”, 89項目の結果
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  • インダストリアル&オートモーティブ 向け長期保証対応製品が登場!!

    (2015年6月22日台湾新竹)ウィンボンドは、低温-40℃~高温95 (AG3) /105 (AG2) /115 (AG2 plus) ℃で使用可能であるだけでなく、 工業用/車載電子の作業環境、またAECQ-100 基準 (車載電子部品評議会AEC,Automotive Electronics Councilが制定した車載電子部品の信頼性試験規格) に適合した2Gb DDR2を発表いたしました。本製品は、最長の製品ライフサイクルサポートを提供しており、最短10年の製品提供、長期使用の保証をいたします。DDR2はx8 FBGA-60 / x16 FBGA-84 の I/O I/O インターフ...

  • オートモーティブ ワールド2015/カーエレジャパン

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • ウィンボンド、ISO 26262のSGS自動車機能安全認証を取得、グローバルでの車載先進安全システムのサプライチェーン参入を目指す

    ウィンボンド・エレクトロニクスは2019年2月21日、車載分野安全規格の最高水準であるISO26262認証を取得したことを発表しました。SGSによるISO26262路上走行車の機能安全規格のプロセス認証を取得は、台湾のメモリ製造企業で初めてのことです。 近年におけるIoV(Internet of Vehicles/車のインターネット)と高度な車載向け製品のニーズの高まりは、世界の大手メーカーから多くの注目を集めています。 「信頼性」と「安全性」は、車載用エレクトロニクス製品認定の際の重要な指標です。 2011年にリリースされた機能安全規格ISO 26262は、車載エレクトロニクスサプライヤがA...

  • フラッシュメモリ - シリアルNORフラッシュ

    ウィンボンドのW25XおよびW25Q SpiFlash®マルチI/Oメモリは、512Kビットから512Mビットまでの容量帯にて、小規模な消去可能セクタ、および業界最高性能を誇る一般的なSPI(シリアルペリフェラルインターフェイス)を備えています。W25Xファミリは、一般的なSPIクロックレートを効果的に2倍にするデュアルSPIをサポートしています。W25Qファミリは、デュアルI/OおよびクワッドI/O SPIを搭載した25Xファミリの「スーパーセット」であり、さらに高いパフォーマンスを実現します。クワッドSPIを使用すると、416MHz(50Mバイト/秒の転送レート)で最大104MHzのクロッ...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond announces new Flash Memory products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories o 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture o 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash® memories support space-saving, cost-effective SO8 package o Dual-Output SPI supports...

  • Winbond Announces New Flash Memory Products - 16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture (Hsinchu, Taiwan – Sep 17, 2007)Over the past 12 years, Winbond has devoted it...

  • Winbond Reports the Financial Results for the Third Quarter of 2010

    Hsinchu, Taiwan, October 29, 2010-Winbond Electronics Corporation announced the results of audited financial statements for the third quarter of 2010 which have been approved by the Board of Directors. Revenue for the third quarter rose 1% QoQ and 51% YoY to NT$8.574 billion due to inventory adjustm...

  • Winbond Announces the Financial Results for the Third Quarter of 2014

    Hsinchu, Taiwan, Oct. 24, 2014- Winbond Electronics Corporation today announced the financial results for the third quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.931 billion, up 2% QoQ. Gross margin was ...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

  • Winbond Electronics Corporation at International Common Criteria Conference 2015 (ICCC 2015)

    Dates: September 22 to 24, 2015 Location: London, England Winbond Electronics Corporation is pleased to announce the participation in the upcoming ICCC 2015 (International Common Criteria Conference 2015) as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about Winbond’s in...

  • Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity

    Winbond to Use Rambus Cryptography Research Division Security Measures to Safeguard Data Integrity Hardware-based security technology will protect sensitive data and encrypted transactions in flash devices SUNNYVALE, Calif. – September 22, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced that Winbon...

  • Winbond Electronics Corporation at GlobalPlatform Trusted Execution Environment (TEE) Conference 2015

    Date: October 13, 2015 Location: Santa Clara, California, USA Winbond Electronics Corporation is pleased to announce the participation in the upcoming GlobalPlatform Trusted Execution Environment (TEE) Conference 2015 as a Gold Sponsor. We sincerely invite you to come to visit us to learn more about...

  • Winbond Announces the Financial Results for the Third Quarter of 2015

    Hsinchu, Taiwan, Oct. 27, 2015- Winbond Electronics Corporation today announced the financial results for the third quarter of 2015. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.534 billion, up 3% QoQ. Gross margin was ...

  • Winbond Announces the Financial Results for the Fourth Quarter of 2015

    Hsinchu, Taiwan, Jan.29, 2016- Winbond Electronics Corporation today announced the financial results for the fourth quarter of 2015. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales in Q4, 2015 were NT$9.84 billion, up 3% QoQ. Gross ...

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