トップページ
製品の捜索結果“ automotive ”, 0 項目の結果
  • 製品 (0)
検索結果が見つかりませんでした。テクニカルサポートにお問い合わせください。
キーワードの捜索結果“ automotive ”, 90項目の結果
  • 全て (90)
  • インダストリアル&オートモーティブ 向け長期保証対応製品が登場!!

    (2015年6月22日台湾新竹)ウィンボンドは、低温-40℃~高温95 (AG3) /105 (AG2) /115 (AG2 plus) ℃で使用可能であるだけでなく、 工業用/車載電子の作業環境、またAECQ-100 基準 (車載電子部品評議会AEC,Automotive Electronics Councilが制定した車載電子部品の信頼性試験規格) に適合した2Gb DDR2を発表いたしました。本製品は、最長の製品ライフサイクルサポートを提供しており、最短10年の製品提供、長期使用の保証をいたします。DDR2はx8 FBGA-60 / x16 FBGA-84 の I/O I/O インターフ...

  • オートモーティブ ワールド2015/カーエレジャパン

    Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

  • ウィンボンド、ISO 26262のSGS自動車機能安全認証を取得、グローバルでの車載先進安全システムのサプライチェーン参入を目指す

    ウィンボンド・エレクトロニクスは2019年2月21日、車載分野安全規格の最高水準であるISO26262認証を取得したことを発表しました。SGSによるISO26262路上走行車の機能安全規格のプロセス認証を取得は、台湾のメモリ製造企業で初めてのことです。 近年におけるIoV(Internet of Vehicles/車のインターネット)と高度な車載向け製品のニーズの高まりは、世界の大手メーカーから多くの注目を集めています。 「信頼性」と「安全性」は、車載用エレクトロニクス製品認定の際の重要な指標です。 2011年にリリースされた機能安全規格ISO 26262は、車載エレクトロニクスサプライヤがA...

  • フラッシュメモリ - シリアルNORフラッシュ

    ウィンボンドのW25XおよびW25Q SpiFlash®マルチI/Oメモリは、512Kビットから512Mビットまでの容量帯にて、小規模な消去可能セクタ、および業界最高性能を誇る一般的なSPI(シリアルペリフェラルインターフェイス)を備えています。W25Xファミリは、一般的なSPIクロックレートを効果的に2倍にするデュアルSPIをサポートしています。W25Qファミリは、デュアルI/OおよびクワッドI/O SPIを搭載した25Xファミリの「スーパーセット」であり、さらに高いパフォーマンスを実現します。クワッドSPIを使用すると、416MHz(50Mバイト/秒の転送レート)で最大104MHzのクロッ...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash ® memories support space-saving, cost-effective SO8 package Dual-Output SPI supports more...

  • Winbond announces new Flash Memory products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel

    16Mb ,32Mb and 64 Mb parallel Flash memories o 16Mb and 32Mb are 70ns, Boot Block and Single Bank Architecture o 64Mb is 70ns, Boot Block and supports page mode, and Flexible Bank architecture 16 and 32 Mb SpiFlash® memories support space-saving, cost-effective SO8 package o Dual-Output SPI supports...

  • Winbond Announces New Flash Memory Products-16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture Over the past 12 years, Winbond has devoted itself to the flash memory market,...

  • Winbond Announces New Flash Memory Products - 16Mb/32Mb/64Mb Parallel Flash

    16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 16 Mb and 32 Mb: 70 ns, Boot Block and Single Bank Architecture 64 Mb: 70 ns, Boot Block (supports page mode), and Flexible Bank Architecture (Hsinchu, Taiwan – Sep 17, 2007)Over the past 12 years, Winbond has devoted it...

  • Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application

    Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application Winbond Announces New 512Mbit mobile LPSDRAM Mar/31/2011 512M mobile LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

  • Winbond Electronics Enters Automotive Flash Memory Market

    Winbond Electronics Enters Automotive Flash Memory Market Serial Flash Memory Leader Applies its Design, Manufacturing Expertise to Provide TS16949-Certified, AEC-Q100-Qualified Devices to Rapidly Expanding Market SAN JOSE, Calif., USA – Feb. 27, 2012 --Winbond Electronics Corp., a leading global su...

  • WINBOND TOP SERIAL FLASH MEMORY SUPPLIER WORLDWIDE, SHIPS 1.7 BILLION UNITS IN 2012, RAMPS 58NM PRODUCTION

    WINBOND TOP SERIAL FLASH MEMORY SUPPLIER WORLDWIDE, SHIPS 1.7 BILLION UNITS IN 2012, RAMPS 58NM PRODUCTION Serial Flash Leader Has Highest Revenue, Most Units Shipped in Fast-Growing Market Increasing Production of 58nm Multi-I/O SpiFlash® Memories from 32Mb to 256Mb SAN JOSE, Calif., USA, and TAICH...

  • Winbond Reports the Financial Results for the Third Quarter of 2010

    Hsinchu, Taiwan, October 29, 2010-Winbond Electronics Corporation announced the results of audited financial statements for the third quarter of 2010 which have been approved by the Board of Directors. Revenue for the third quarter rose 1% QoQ and 51% YoY to NT$8.574 billion due to inventory adjustm...

  • Winbond Announces the Financial Results for the Third Quarter of 2014

    Hsinchu, Taiwan, Oct. 24, 2014- Winbond Electronics Corporation today announced the financial results for the third quarter of 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were NT$9.931 billion, up 2% QoQ. Gross margin was ...

  • Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 Americas

    Date : 2014/4/8-2014/4/11 Location : Dallas, Texas at the Gaylord Texan Resort& Convention Center Booth : Space Plus Winbond Electronics Corporation America will participate in the Freescale Technology Forum (FTF) 2014 Americas as a Silver Sponsor. Come visit Winbond in the Technology Lab April 8 to...

  • Winbond Electronics Corporations in electronica 2014

    Date : 2014/11/11-2014/11/14 Location : New Munich Trade Fair Center Booth : Hall A6 Booth 570/3. Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond’s memory solutions for Automoti...

TOP

Copyright © Winbond All Rights Reserved.

This website uses cookies to ensure you get the best experience on our website. Learn more
OK