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Winbond Introduces Multiple Key Chips and IC Design Technologies at 2008 IIC-China

  • Date:
    March 3 to 4, 2008 (Shenzhen), March 10 to 11, 2008 (Shanghai)
    Location:
    Shenzhen Convention and Exhibition Center‧Shanghai Mart
    Booth:
    Shenzhen 2J29‧Shanghai 4B10

Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. We are proud to introduce multiple Winbond IC designs as well as new products at the Shenzhen Convention and Exhibition Center (March 3th and 4th) and Shanghai Mart Expo (March 10th and 11th). Our complete product line including Mobile RAM, Flash Memory, Computer Logic IC and μ C & μC Based Consumer IC. Details of products on display as follows: 

Mobile RAM For Mobile Phones

• SDRAM:64Mb(W9864 Series), 128Mb(W9812 Series) and 256Mb(W9825 Series) 
• Low Power Mobile Memory

Flash Memory For Information Electronics 

• New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel 
• Industry's First QUAD-SPI Serial Flash Memory

μC and μC Based Consumer IC For Consumer and Automobile Electronics

• New USB Audio Controller Chip Gives Time-to-Market Edge for USB VoIP Phones and PC Audio Peripherals
• World’s First Multi-Message ChipCorder® for Direct Trigger Applications
• First Quad Programmable Extended CODEC/SLIC IC Optimized Short-Loop VoIP Applications

More information about 2008 IIC-China, visit: http://www.china.iicexpo.com/

Note: Winbond and ChipCorder are registered trademarks of Winbond Electronics Corp..  All other trademarks and copyrights mentioned herein are the property of their respective owners.


Event Contact:
Erin Chou
Sales Promotion Dept.
TEL: +886-3-5770066 ext:1086
Email: chchou7@winbond.com

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