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Winbond Introduces Products for Broad Range Applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM

Introducing products for broad range applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM

Winbond has introduced a family of DDR2 SDRAM products based on advanced DRAM technology, including 256Mb (W9725G6IB series), 512Mb (W9751G6IB series) and 1Gb (W971GG6IB series). These products are all in compliance with ROHS, and JGPSSI standard, and are designed to support wide range of electronic products.

The W97 DDR2 series benefit from the following advantages:

Winbond is an IDM(Integrated Device Manufacturer) specialty DRAM provider who is capable of R&D, manufacturing, as well as sales and marketing. Winbond provides customers with high performance, high reliability products that are produced in its own 12” wafer facility. The in-house wafer fabrication provides customers with full commitment in capacity support and delivery flexibility, which are not generally available from other niche DRAM suppliers. Winbond has engaged in business with customers from worldwide, including Taiwan, China, Japan, America, and Europe. Winbond is committed to continuously bringing out high performance and cost competitive products to better serve our customers.

All samples are available now. For specific lead-time, pricing and additional information, please contact your local Winbond representative or distributor.
Or you can mail to SDRAM@winbond.com for any request.

About Winbond

Winbond Electronics Corporation is the Memory IC Company with professional capacity in product design, manufacturing, and sales services. By continuous innovation in technology, the Company strives to provide and develop customer-driven memory solutions.  

As the first-rate semiconductor company, Winbond exploits its advanced design skills and production technologies to continually boost the competitive advantages of its dedicated brand-name products. Winbond’s three business groups each focus on specific fields. Of which, DRAM Product Business Group specializes in Mobile RAM and Specialty DRAM products which are designed to meet the demands of niche mobile memory market for high-speed memory with low-power consumption. Flash Memory IC Business Group offers low/medium density NOR Flash products including parallel Flash and serial Flash for the computer, consumer and communication markets. Based on a 300 mm wafer fab, Memory IC Manufacturing Business Group keeps pace with the latest technologies to provide high-quality memory IC manufacturing services. Now the 300 mm wafer fab is running at a monthly capacity of 30,000 wafers and production technologies covers from 90nm to 65nm.

Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidies in America, Japan, and Hong Kong. For more information, please visit: http://www.winbond.com.

Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Product Contact:

Eddy Hung
Specialty DRAM Marketing Division
TEL: +886-3-5678168 # 5586
Email: WCHung@winbond.com

News Contacts:

Lily Chien
Sales Coordination Dept.
TEL: +886-2-81777168 # 1338
Email: KLChien@winbond.com

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