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Winbond Holds Groundbreaking Ceremony for New Fab at Kaohsiung Science Park of Southern Taiwan Science Park

Winbond Electronics Corp. held the groundbreaking ceremony for its new Kaohsiung Fab at Kaohsiung Science Park of Southern Taiwan Science Park (STSP) today. The new Kaohsiung Fab, Winbond’s second 12-inch fab, is expected to fulfill the market demand and the commitment to customers. It will mark another milestone for the Company’s development in memory market.
The ceremony was hosted by Chairman & CEO of Winbond Arthur Yu-Cheng Chiao, and witnessed by the guests including Secretary-General to the President Chen Chu, Minister of Science and Technology Chen Liang-gee, Director General of Industrial Development Bureau Leu Jang-hwa, Kaohsiung Deputy Mayor Hsu Li-ming, and Director General of Southern Taiwan Science Park Bureau Lin Wei-cheng.
Total land area of Winbond Kaohsiung Fab is 25 hectares. The Company expects to complete the fab construction in 2020 with volume production in 2021, and will increase the capacity along with market demand. The Kaohsiung Fab will be designed as a smart manufacturing 12-inch fab with in-house 25nm process technology to offer high quality Specialty DRAM to customers in order to meet future demand emerging from IoT, AI, and Industrial Automation. Winbond Electronics commits environmental sustainability and will continue applying its high standards for energy saving, carbon emission reduction and waste disposal.
Winbond Electronics devotes to total memory solutions. We are ranked the world's top five branded DRAM manufacturer and top one NOR Flash supplier. Winbond is one of a handful of memory solution providers with both DRAM and Flash product lines in the world. Following the increasing applications of memory products, the newly added capacity, together with in-house technologies and flexible production allocation capability will enable the Company to take the advantage of the industry opportunity and increase market share and industry position.
The construction of Kaohsiung Fab in the Southern Taiwan Science Park is a key part of Winbond’s commitment to continue its investment in Taiwan. With the industrial clustering effect driven by the investment, it is expected to increase employment opportunities and enhance economic value. In the future, Winbond will endeavor to maintain its superior competitiveness and create more value for the development of Taiwan memory industry.

Spokesperson
Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL:
886-3-5678168
886-987-365682

News Liaison
Mandy Wang
TEL:
886-3-5678168 #71477
886-975-995525
E-mail:YCWang16@winbond.com

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