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Winbond Embedded World Booth Cancellation

(Taichung, TAIWAN – 14 February, 2020-- Winbond Electronics Corporation has been closely monitoring the situation related to the novel coronavirus outbreak, and we are taking great precautions to deal with this issue.
With due regard to the safety and health of our employees, suppliers, partners and customers, Winbond has decided to cancel its participation in Embedded World this year in Nürnberg, Germany.

We thank the NürnbergMesse GmbH and the public for the understanding and look forward to attending in the future.

 

About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond’s headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong.

Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

 

 

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


News Contact
Yulia Lee
Digital Marketing Manager
TEL: +886-3-5678168 Ext.75395
E-mail: ylli5@winbond.com

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