Winbond at Embedded World 2024

ウィンボンドは4月9日から11日まで開催されるEmbedded World 2024に出展いたします。今年のEmbedded World 2024では、いくつかの新製品技術発表とデモを行いますので、ぜひウィンボンドブース4A-635にお立ち寄りください。

今後数年間、端末機器におけるエッジコンピューティングが世代交代を要求される中、AIおよび5Gテクノロジーの開発によりIoTのレベルが大幅に押し上げられ、車載向けエレクトロニクスや産業用IoTはさらに発展することが予想されます。
ウィンボンドはこれらの変化に柔軟に対応し、みなさまのお役に立てるよう努めてまいります。

ウィンボンドブースでは、3つの製品ラインとその主力商品をご紹介いたします。

1. Specialty DRAM and Mobile DRAM

• DDR3 and HYPERRAM with STM32 series
• 4Gb LPDDR4 with Mobileye EyeQ4H for ADAS Application
• 2Gb DDR3 with NXP i.MX6 for SOM Application

2. Code Storage Flash Memory

• Low power and Known Good Die Serial NOR Flash for TWS
• Built-in ECC and Support XIP QSPI NOR Flash with NXP LPC553S3x
• 1.2V Serial NOR Flash for MacBook Pro 14" Late 2023

3. TrustME®

• W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS and so one.

ウィンボンドブース  4A. 635にて、来場者バッジスキャンと引き換えに無料プレゼントをGETしてください！

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event contact
Yulia Lee
Digital Marketing Adminstrator
TEL: 886-3-5678168 Ext.78515
E-mail: YTHsu2@winbond.com