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Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

Winbond 2007 IIC-China

Shenzhen
March 5-6 th , Shenzhen Convention and Exhibition Center
Booth No.:2C25
Shanghai
March 13-14 th, Shanghai Mart
Booth No.:4C07

Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well as new products will be on display at the Shenzhen Convention and Exhibition Center (March 5 th and 6 th) and Shanghai Mart Expo (March 13 th and 14 th). Our complete product line including Mobile RAM, Computer Logic IC, Flash Memory, and μ C & μC Based Consumer IC etc. will all be on display. Details of products on display as follows:

Mobile RAM For Mobile Phones

Computer Logic IC & Flash Memory For Information Electronics

μC and μC Based Consumer IC For Consumer and Automobile Electronics

About Winbond

Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.

Winbond owns two business groups:

Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.

More information about 2007 IIC-China, visit: http://www.china.iicexpo.com /

 


Event Contact:

Erin Chou
Sales Promotion Dept.
TEL: +886-3-5678168 ext:8686
Email: chchou7@winbond.com

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