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Winbond is attending the Taitronics 2008 and introducing products for broad range applications

Introducing products for broad range applications: 16Mb, 64Mb, 128Mb, 256Mb SDRAM 

Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce our SDRAM products for broad range applications, including: 16Mb (W9816 series), 64Mb (W9864 series and W9464 series), 128Mb (W9812 series and W9412 series), 256Mb (W9825 series and W9425 series). These products are all in complaint with ROHS, and JGPSSI standard, and are designed to support various consumer electronic products.

The W98 series, and W94 series benefit from the following advantages: 

Among niche DRAM manufacturers, Winbond is one of the few IDM (Integrated Device Manufacturers) who is capable of R&D, manufacturing, as well as sales and marketing. Winbond provides customers with high performance, high reliability products that are produced at our own 12” wafer facility. The in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility, which are not generally available from other niche DRAM suppliers. Winbond has engaged in business with customers in worldwide, including Taiwan, China, Japan, America, and Europe. Winbond is committed to continuously bringing out high performance and cost competitive products to better serve our customers.

All samples are available now. For specific lead-time, pricing and additional information, please contact your local Winbond representative or distributor.
Or you can mail to SDRAM@winbond.com for any request.

About Winbond

Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan and has been publicly traded on the Taiwan Stock Exchange since 1995. In October 2008, the headquarters is relocated to Central Taiwan Science Park where newly built the 300mm wafer fab. The site is mainly focusing on research & development and production, of which the process technology covers from 90nm~65nm.

Winbond focuses on the Memory Products design and manufacturing with three main business groups—DRAM Product Business Group, Memory IC Manufacturing Business Group, and Flash Memory IC Business Group. To maintain its long-term relationships with its customers and strengthen regional supports, Winbond has set up subsidiaries in the USA, Japan, and Hong Kong.

For more information, please visit: http://www.winbond.com

Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Product Contact:

Eddy Hung
Specialty DRAM Marketing Division
TEL: +886-3-5678168 # 5586
Email: WCHung@winbond.com


News Contacts:

Lily Chien
Sales Coordination Dept.
TEL: +886-2-81777168 # 1338
Email: KLChien@winbond.com

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