| Density | 128Mb | Industrial Status | Not Recommend for New Design |
|---|---|---|---|
| Vcc | 2.7V - 3.6V | Frequency | 133MHz |
| Package | SOIC8 208mil, WSON 8X6mm, WSON 6X5mm | Temperature Range | -40 ℃ ~ 125℃ |
| Feature List | Unique ID and Manufacture ID for Root keys, CID, and GID Generation OTP and Unreadable Secure Storage for Root Keys Flash Based Monotonic Counter for Timestemp HMAC SHA-2 Hardware Engine for One-Time-Password Mutual Authentication Winbond SPI Flash Command and Specification Compatible |
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Technical Documentation
Resources
Winbond QspiNAND Flash Product Brief
Product Brief
- File Type：PDF
- Updated：Thu Mar 07 14:41:12 CST 2024
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ウィンボンド、低消費電力で小型のIoT機器向けに 次世代8MビットシリアルNORフラッシュを発表
Product Press
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- Updated：Thu Jun 15 15:00:00 CST 2023
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Winbond Authentication Flash Product Brief
Product Brief
- File Type：PDF
- Updated：Sun Mar 05 12:59:39 CST 2023
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New Memory and Security Technologies for Designers of IoT Devices
Video
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- Updated：Thu Dec 06 17:54:55 CST 2018
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Winbond embedded world 2018_Authentication and SpiStack Flash Memory
Video
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- Updated：Thu Jun 14 10:58:00 CST 2018
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